The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2016.51
Session ID : 138
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138 Effect of the Crystallinity of Underlayer Material on Microtexture of electroplated Copper thin Film
Jiatong LIU, Ken SUZUKI, Hideo MIURA
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Keywords: Thermal Stress, Reliability, Microtexture, Thin Film, Electroplated copper thin film
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© 2016 The Japan Society of Mechanical Engineers
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