The Proceedings of Autumn Conference of Tohoku Branch
Online ISSN : 2424-2721
2007.43
Session ID : 203
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203 Mechanical properties of intermetallic compounds formed at the interface between lead-free solder and electroplated copper thin film
SC JEONG, Ken SUZUKI, Hideo MIURA
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Keywords: Residual Stress, Residual Strain, Finite Element Analysis, Pb-free Solder
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© 2007 The Japan Society of Mechanical Engineers
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