The Proceedings of Autumn Conference of Tohoku Branch
Online ISSN : 2424-2721
2015.51
Session ID : 104
Conference information
104 Development of Strain Sensor for The Measurement of Residual Stress in 3D Chips
Koki ISOBE, Ken SUZUKI, Hideo MIURA
Author information
Keywords: Reliability, Stress Measurement, Residual Stress, Piezoresisrive Sensor
CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Details
Download PDF (575K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2015 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top