The Proceedings of Conference of Tokai Branch
Online ISSN : 2424-2748
2001.50
Session ID : 221
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221 Inelastic Constitutive Modeling of a Lead-Free Solder Alloy
Tomofumi ISHIKAWA, Mineo KOBAYASHI, Nobutada OHNO, Hiroyuki TAKAHASHI, Minoru MUKAI, Takashi KAWAKAMI
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Keywords: Lead-Free Solder Alloy, Constitutive Equation, Viscoplasticity, Creep
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© 2001 The Japan Society of Mechanical Engineers
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