The Proceedings of Conference of Tokai Branch
Online ISSN : 2424-2748
2004.53
Session ID : 424
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Molding of bamboo powder without adhesive : Effect of temperature and moisture content
Osamu YAMASHITAShiro KIMURAHiroshi IMANISHIKozo KANAYAMA
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© 2004 The Japan Society of Mechanical Engineers
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