The Proceedings of Conference of Tokai Branch
Online ISSN : 2424-2748
2015.64
Session ID : 118
Conference information
118 Grain boundary-induced variation of the local strength of the interface between the copper and the insulation layer
Ryota OCHI, Nobuyuki SHISHIDO, Hisashi SATO, Kozo KOIWA, Shoji KAMIYA, Masahiro NISHIDA, Masaki OMIYA, Takashi SUZUKI, Tomoji NAKAMURA, Takeshi NOKUO, Toshiaki SUZUKI
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Keywords: Grain boundary, Interface strength, LSI interconnect
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© 2015 The Japan Society of Mechanical Engineers
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