Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2000
Conference information
Effect of Intermetallic Compound Layer Development on Interface Strength of Solder joints
Masaki OMIYA, Yuya NAKAKO, Kikuo KISHIMOTO, Toshikazu SHIBUYA, Masazumi AMAGAI
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Keywords: Eutectic Solder, Thermal aging, Intermetallic compound, Tensile strength
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 231-232

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© 2000 The Japan Society of Mechanical Engineers
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