Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2000
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Fatigue Life Prediction of Pb Free Solder Using Constitutive Model for Viscoplasticity
Kenichi OHGUCHI, Katsuhiko SASAKI, Hiromasa ISHIKAWA, Akiyuki YANAGIMOTO
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Keywords: Pb Free Solder, Viscoplasticity, Constitutive Model, Fatigue Life Prediction, Electronic Packaging
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 519-520

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© 2000 The Japan Society of Mechanical Engineers
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