Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2000
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Thermal Deformation Measurement on Electronic Packaging by Moire Interferometry
Kazuo ARAKAWA, Mitsugu TODO, Shinji YAMADA, Yashuyuki MORITA, Kiyoshi TAKAHASHI
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 537-538

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© 2000 The Japan Society of Mechanical Engineers
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