212 Evaluation for High Temperature Thermal Deformation of Electronic Devices
Yasuyuki MORITA, Kazuo ARAKAWA, Mitsugu TODO, Youichi UENO, Kiyoshi TAKAHASHI, Masayuki KANETO
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Keywords:
Electronic Device,
Thermal Deformation,
Moire Interferometry,
Flip-Chip,
Coefficient of Thermal Deformation (CTE),
Low-CTE Substrate
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Article 1st page
