Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2001
Session ID : 457
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457 Evaluation of Fracture Mechanics Parameters of IC Packages Subjected to Non-steady Thermal Stress
Kenji MACHIDA, Hiroyuki OKAMURA, Kenichi SHIROTA
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Keywords: Finite Element Method, Strain Energy Release Rate, Delamination Interface, Virtual Crack Extension Method, Modified Crack-Closure Integral
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© 2001 The Japan Society of Mechanical Engineers
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