Impact Tensile Properties of Sn-3.0Ag-0.5Cu Lead-free Solder

Proceedings of the 1992 Annual Meeting of JSME/MMD

Online ISSN : 2433-1287

2002

DOI https://doi.org/10.1299/jsmezairiki.2002.0_229

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Impact Tensile Properties of Sn-3.0Ag-0.5Cu Lead-free Solder

Ken KAMINISI, Takesi MARUICHI, Tsutomu SEKINE

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Keywords: Lead-free Solder, Hopkinson Bar, Sn-3.0Ag-0.5Cu Solder, Impact Tensile Test

CONFERENCE PROCEEDINGS FREE ACCESS

Pages 229-230

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© 2002 The Japan Society of Mechanical Engineers

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