Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2002
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Delamination Inspection in IC Packages Using Dry-Contact Ultrasonic System
Hironori TOHMYOH, Masumi SAKA
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Keywords: Ultrasonic Inspection, Dry-Contact Ultrasound, Higher Frequency, Electronic Packages, Delamination
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 521-522

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© 2002 The Japan Society of Mechanical Engineers
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