Mechanical Characteristics and Fracture Phenomena of Dismantlable Adhesive Including Thermally Expansive Microcapsules

Abstract

Mechanical characteristics and Fracture phenomena of dismantlable adhesive including thermally expansive particles were investigated experimentally and analytically. The adhesive could swell due to the expansion of the microcapsules by heating and internal stress occurred in the adhesive layer confined in joints. By the stress, interfacial cracks or the pits of partial debonding along the interfaces were caused and led to the total dismantlement. The expansive properties of the microcapsules were measured experimentally using PVT apparatus under the condition of particular pressure and temperature. The stress intensity factors near the tips of the carcks or the pits along the interface of the adhesive and adherend were calculated based on the data obtained in the experiments. The failure condition of the joint, which consisted of glass adherends, was observed using a microscope to verify the calculated results.