Fatigue Crack Initiation/Propagation Behavior in Surface-Bonded Copper Films

Proceedings of the 1992 Annual Meeting of JSME/MMD

Online ISSN : 2433-1287

2003

DOI https://doi.org/10.1299/jsmezairiki.2003.0_311

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Fatigue Crack Initiation/Propagation Behavior in Surface-Bonded Copper Films

Akira MATSUBA, Tashiyuki TORII

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Keywords: Fatigue, Crack Initiation, Crack Propagation, Crack Opening Displacement, Surface Film-Bonding, Pure Copper Film, Epoxy Resin, Film Thickness, Multiple Cracks

CONFERENCE PROCEEDINGS FREE ACCESS

Pages 311-312

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© 2003 The Japan Society of Mechanical Engineers

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