Examination of the impact test equipment used for the assessment of drop impact reliability for the solder joints

Abstract

The tendency of portable telephone and miniaturization of electronic equipment that it is supposed in book-size personal computer, etc., portable type is remarkable in recent years. The impact breakdown in the soldered joints division by the falling surfaces with it as a new problem. However, the elucidation of the effect of the whole package of the behavior on soldered joints divisions is insufficient to the destruction, and it is necessary to clarify the behavior, when the impact breakdown in the soldered joints division is evaluated. Then, it is necessary to clarify the behavior, when the impact breakdown in the soldered joints division in evaluated.