Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2005
Session ID : 216
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216 Young's Modulus Measurement of Thin Micro Element and Fine Element Analysis under Bending
Kazuto TANAKAKohji MINOSHIMATakehiro IMOTOYohei OGINOSusumu SHIMA
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

Mechanical properties of thin polysilicon microelements were evaluated by using the nano mechanical test system. The in-situ image observed by the indenter probe helps to position it within sub-micrometers of the desired test location. The Young's modulus obtained by bending tests with a help of FEM analysis was 145GPa To analyze the effect of the crystal orientations on the Youngs modulus, three-dimensional finite element model was developed using a Voronoi structure. The crystal orientation of the film was analyzed by means of an electron back-scattering diffraction pattern (EBSP) method The front surface of the film had no oriented structure. Therefore, random crystal orientation was given to each grain of the FEM model. Young's modulus obtained by this FEM analysis was 161GPa.

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© 2005 The Japan Society of Mechanical Engineers
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