Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2005
Session ID : P1
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P1 Thermal fatigue reliability prediction of lead-free solder joint with strain measurement on the basis of digital image correlation technology
Jae-Chul JIN, Qiang YU, Tadahiro SHIBUTANI, Masaki SHIRATORI
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© 2005 The Japan Society of Mechanical Engineers
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