Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2005
Session ID : P11
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P11 Fatigue crack growth behavior of 63Sn-37Pb solder evaluated by C^*-parameter
Toshihiro Nagatani, Chaosuan Kanchanomai, Yukio Miyashita, Yoshiharu Mutoh
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Keywords: Fatigue crack growth, Creep crack growth, Crack growth rate, C^*, Solder
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© 2005 The Japan Society of Mechanical Engineers
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