Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2006
Session ID : 414
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414 Study on establishing creep testing method by using miniature size specimen of lead and lead free solders
Akira UENO, Reiji SATO
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Keywords: Solder, Lead-free solder, Creep, Miniature size specimen
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© 2006 The Japan Society of Mechanical Engineers
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