Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2006
Session ID : 106
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106 Plane thermal stresses in the functionally graded plate with the slanting boundary to the functional gradation
Manabu OHMICHINaotake NODA
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Abstract
This paper presents plane thermal stresses in a functionally graded plate (FGP) with the slanting boundary to the functional gradation subjected to a partial heating. The heat conductivity, Young's modulus and the coefficient of the linear thermal expansion are expressed by exponential functions of the position in the functionally graded coordinate. The steady thermal stresses in the FGP with the slanting boundary to the functional gradation under two-dimensional temperature distribution are obtained by use of the stress function method. The numerical calculations are carried out for ZrO_2/Ti-6Al-4V and ZrO_2/stainless (SUS304) functionally graded plates, when the ceramic surface is partially heated.
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© 2006 The Japan Society of Mechanical Engineers
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