Journal of the Society of Materials Science, Japan
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
Technical Topic
Current Issues and Future Direction of Low Cost High Density Packaging Technology
Yutaka TSUKADA
Author information
Keywords: Flip chip, Build-up, Pattern plating, YAG laser, Underfill, BOAC, Area array, SiP
JOURNAL FREE ACCESS

2006 Volume 55 Issue 4 Pages 385-390

Details
Download PDF (716K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2006 by The Society of Materials Science, Japan
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

journal of the Japan Society for Testing Materials

Share this page
feedback
 Top