Journal of the Society of Materials Science, Japan
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
New Challenges for Thermo-Mechanical Fatigue
III : Thermo-Mechanical Fatigue in Electronic Devices
Masao SAKANE
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Keywords: Thermo-mechanical fatigue, High temperature, Electronic device, Solder, Thermal stress, Creep-fatigue
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2007 Volume 56 Issue 3 Pages 302-308

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© 2007 by The Society of Materials Science, Japan
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