2009 Volume 58 Issue 9 Pages 753-758
The mechanical and thermal properties of epoxy resin used for electronic parts are changed by thermal load in manufacturing processes and prolonged use, and these properties make defective of electronic devices. In this report, warp behavior of a two-layer-laminated body consisting of epoxy resin and steel caused by thermal load were examined from both sides of experiment and theory. As a result, it was clarified that viscoelastic properties of epoxy resin, such as storage modulus, loss modulus, loss tangent and glass transition temperature were changed by thermal load, and that warp behavior could be predicted by thermo-viscoelastic analysis based on linear thermo-viscoelastic theory by using these viscoelastic properties.
