Abstract
Diffraction method is very useful to evaluate the stress/strain of crystalline material. Especially, the X-ray method has been widely used for measurement of the stress in engineering components. However, when the very small measurement area is required, accuracy of determination by the X-ray method may be insufficient. On the other hand, spatial resolution of EBSD method becomes a nanometer order. In the present study, in-situ measurement of the stress/strain distribution near notch in 3%Si iron was carried out by EBSD method. Obtained results were compared with the results analyzed by the finite element method. The strain near notch could be measured within the scatter of ±500 micro strain. Ten point average value of the strain was almost identical to the macro strain distribution calculated by FEM. For the stress distribution in the elastic region, hundred point average value was coincident with the calculated result. For the plastic deformation, change of the angle of crystal rotation corresponds to the displacement of the specimen surface. Kernel averages misorientation increased with the plastic deformation.
