Stress Measurement of Coarse Grains Using Double Exposure Method

Abstract

The double exposure method (DEM) is proposed herein as a new X-ray stress measurement method for coarse grain materials. A diffraction angle can be obtained from an incident and a spotty diffracted beam. Each X-ray beam is measured by an area detector on a linear motion stage on the 2 θ-arm in the DEM. To examine the validity of the DEM, the residual stress of the plastically bent specimen was measured. In addition, the residual stress distribution of the indentation specimen was measured. The result by the DEM was similar to the result simulated by the finite element method. As a result, the DEM is useful for the X-ray stress measurement method for coarse grain material.