Effect of Surface Roughness of WC-Co Substrate on TiN Film by CVD Process

Abstract

The characteristics of TiN film coated on WC-Co alloy by CVD process were studied as a function of surface roughness of the substrate which was prepared by grinding and re-sintering after ground. It was found that the orientation of TiN film decreased with increasing surface roughness of substrate. The residual stress of TiN film determined by X-ray stress measurement was tensile and that of WC phase in substrate was compressive. The critical load at scratch tests increased with increasing thickness of TiN film and surface roughness of substrate. The half value breadth in WC phase showed good correlation with the critical load at the scratch test.