Journal of the Society of Materials Science, Japan
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
Single Incidence X-Ray Stress Measurement for All Plane Stress Components Using Imaging Plate of Two-Dimensional X-Ray Detector
Toshihiko SASAKIYukio HIROSE
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1995 Volume 44 Issue 504 Pages 1138-1143

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Abstract

This study was performed to examine the possibility of X-ray measurement by analyzing the whole part of Debye-Scherrer ring. An imaging plate (IP) was used for the detection of X-ray in order to obtain a high degree of accuracy and efficiency. Through the investigation on the Tanaka's method, we proposed new equations for σy and τxy. We also found that the Tanaka's method involved an assumption that the angle η is constant. So we proposed a new method for the determination of stress from Debye-Scherrer ring without the above approximation on angle η. For the experiment, a new system of processing image data, calculating stresses and a back-reflection Laue camera for IP with a four-point-bending-device was manufactured. The stress applied mechanically with this device was compared to that obtained from the present method. The result showed that it was possible to obtain the stress with the same accuracy as that obtained by the sin2φ method. The advantage of this method is that one can obtain all three components of the stress in a plane stress state from one diffraction ring with single incidence of X-ray beam.

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