Abstract
The X-ray stress measurement for a coarse grained TiAl intermetallic compound was carried out to measure residual stress on various surfaces. It is, however, difficult to decide peak positions accurately because of spotty diffraction rings due to coarse grains and low P/B diffraction profiles obtained from worked surfaces. In the present study, an X-ray stress measurement method using an imaging plate (IP) and a conventional X-ray stress measurement method were applied to these surfaces. The results obtained are; (1) The X-ray stress measurement using the IP, adopted a software oscillation method and an X-Y plane oscillation method, was effective to obtain accurate residual stress values from the coarse grained TiAl intermetallic compound. (2) The conventional method was more useful for low P/B diffraction profiles than the method using the IP. (3) By applying a suitable X-ray stress measurement method to each surface, residual stress values were able to be obtained quantitatively.
