Published: February 15, 1998Received: June 10, 1997Available on J-STAGE: June 03, 2009Accepted: June 10, 1997
Advance online publication: -
Revised: -
Correction information
Date of correction: June 03, 2009Reason for correction: -Correction: DTRECEIVEDDetails: Right : 19970610
Date of correction: June 03, 2009Reason for correction: -Correction: TITLEDetails: Wrong : Lecture Right : Micromaterials
Date of correction: June 03, 2009Reason for correction: -Correction: SUBTITLEDetails: Right : III: Microelemtent Fabrication Technology
Date of correction: June 03, 2009Reason for correction: -Correction: AUTHORDetails: Right : Tanemasa ASANO1)
Date of correction: June 03, 2009Reason for correction: -Correction: AFFILIATIONDetails: Right :
1) Center for Microelectronic Syst., Kyushu Inst. of Tech.
Date of correction: June 03, 2009Reason for correction: -Correction: KEYWORDDetails: Right : Micromaterial, Microfabrication, Micromachining, LIGA, Fast atom beam, Anodization, Beam induced process
Date of correction: June 03, 2009Reason for correction: -Correction: CITATIONDetails: Right : 2) S. M. Sze, ed., “Semiconductor Sensors” (1994) John Wiley & Sons, Inc.. 4) T. Asano and J. Yasuda, Jpn. J. Appl. Phys., 35, 6632 (1996). 5) T. Asano, Y. Oobuchi and S. Katsumata, J. Vac. Sci. Technol., B13, 431 (1995). 6) Y. Okada, K. Makihira and T. Asano, unpublished. 7) K. Higa and T. Asano, Jpn. J. Appl. Phys., 35, 6648 (1996). 9) H. Morimoto, M. Yamashita, T. Kishimoto, M. Takai, S. Yura, A. Hosono, S. Okuda, S. Lipp, L. Frey and H. Ryssel, Digest of Papers, The 9th Int. Microprocess Conf., p. 248 (1996). 11) T. Suga, T. R. Chung, L. Yang, N. Hosoda and H. Takagi, Ext. Abs. 1996 Int. Conf. Solid State Devices and Materials, p. 461 (1996).