Abstract
In this study, we investigate the residual stress of titanium carbide films with the X-ray diffraction method. It is difficult to determine the stress by conventional X-ray stress measurement, i.e., the sin2ψ technique, because the sin2ψ technique requires macroscopic isotropy from the specimen but the ‹110› orientation is observed for our evaporated TiC films by chemical vapor deposition. Therefore, in this paper, the X-ray stress measurement for ‹110›-oriented films was formulated by introducing the weighted average method. The formulation showed that the relation between the stress of the specimen and the strain measured by X-ray diffraction depended on the measured diffraction planes. Then, a stress calculation was performed and discussed based on the loading experiments.
