Journal of the Society of Materials Science, Japan
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate
Takao HANABUSAMasayuki NISHIDA
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2001 Volume 50 Issue 3Appendix Pages 54-60

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Abstract
The present study investigates the behavior of residual stress and thermal stress in thin copper films with X-rays. The copper films were deposited on a glass substrate by radio frequency (RF) sputtering. In-situ thermal stress measurement was also made on copper films during heat cycles. The residual stress of as-deposited state was tensile regardless of the conditions of film preparation. Early in the cooling stage, thermal stress behaves in an elastic manner so as to reduce the tensile stress until it stabilizes close to zero. In the cooling stage, little increase in the thermal stress was observed above 100°C and the hysteresis of thermal cycle was very small.
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