Journal of Japanese Society of Oral Implantology
Online ISSN : 2187-9117
Print ISSN : 0914-6695
ISSN-L : 0914-6695
An Evaluation of the Solder Joint on the Fitness of Frame in the Osseointegrated Implant
Ayako MorishitaHiroki SuzukiYuko MiyashitaTakao NomuraHiromi HottaIchirp ShimamuraYasushi AdachiMasataka Kishi
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2001 Volume 14 Issue 2 Pages 197-204

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Abstract
To clarify the improvement of frame fitness for osseointegrated implants, the difference in the horizontal distance of bounded gold cylinder between a one-piece cast frame and a solder joint were compared. Working stone models with abutment replica were made from a simulation model of an edentulous mandible which installed five fixtures in the acrylic resin block, then both five frames including five and four gold cylinders were made. To evaluate the dimensional change during solder joint of these frames, the horizontal dimension of all bounded gold cylinder were measured at the one-piece cast frame before separating them. Then these frames were divided into two to three gold cylinders, or two to two gold cylinders, and then they were solder the put carefully. The horizontal dimension of all bounded gold cylinder was also measured after solder joint of them. The tightness of gold screw that shows good fitting of frame was improved after solder joint in all cases at the end of the frame, but it improved less at the bounded gold cylinder. The mean value of the differences of the bounded gold cylinder, including the solder joint,was 102±56 mm. Results suggested that a solder joint was effective to reduce the total inter gold cylinder distance in a large frame.
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© 2001 Japanese Society of Oral Implantology
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