Abstract
In this study, bond strengths of Ti implant substrate to Ti and 12% Au-Ag-Pd superstructure materials, using bonding agent, were investigated. The study examined the influences of blasting surfaces with different media including glass beads, alumina powder, and carborundum powder on bond strengths.
The main results were as follows:
1. The surface of the Ti substrate blasted with glass beads revealed a roundish unevenness.
2. The Ti surface blasted with alumina powder was rougher with sharp unevenness.
3. The surface blasted with carborundum powder showed simikar topological features to the alumina-blasted surface, but was much rougher.
4. The bond strengths of the glass-beads-blasted Ti substrate exhibited the minimum values for both Ti and 12% Au-Ag-Pd alloy.
5. The maximum bond strength was obtained on the alumina-blasted Ti surface for both Ti and 12% Au-Ag-Pd alloy.
