Abstract
In Chemical Mechanical Polishing (CMP), pad conditioning is a very important technique. Chip Manufactures have problems with semiconductor wafers getting scratched by diamond fragments and slurry waste particles on the surface and inside the pad. Fragments in the pad cause pad life to be too short. In this report, we will mention the development of a new cleaning system that uses water in a high-pressure micro jet system (HPMJ), which controls the kinetic energy of the droplets to solve these problems. We measured the velocity distribution and the size distribution of the fluid droplets sprayed from the HPMJ. The kinetic energy of each water droplets was calculated from velocity, droplets size, and flow rate within the sprayed pattern. Further more, we have confirmed the kinetic energy result by studying the effect of the HPMJ as a conditioning tool on an unwoven fabric polyester type pads and a bubble urethane type pads that are widely used in CMP process.
