Improvement of Thickness Uniformity of Quartz Wafer by Numerically Controlled Plasma CVM

—Correction of Thickness Variation of Quartz Wafer by Numerically Controlled Machining Utilizing Rotary Electrode—

Abstract

For the purpose of machining an ultra high frequency quartz resonator, we study making of quartz wafer with uniform thickness by Plasma CVM. In this paper, it was to examine the relationship between machining characteristics and machining parameters (composition of reactive gas, RF power density, machining gap, rotation speed of electrode, etc.) in order to form an optimum shape of the unit removal spot. Then, correction of thickness variation of quartz wafer by the numerically controlled plasma CVM was carried out by utilizing the rotary electrode. Fabricated quartz wafer had small thickness variation (PV 67nm, and standard deviation 16nm), and total processing time was only 94 seconds.