Development of a Measuring Instrument for Nanoparticles on the Si Wafer Using a Laser Light Scattering Method

-Estimation of Detection Accuracy and Wet Cleaning Effect Using Standard Nanoparticle-

Abstract

The measuring system for particles with diameter of nanometer order sizes on a Si wafer surface using a laser light-scattering method has been developed. To estimate this measuring system, the measurement of a standard particle on a bare Si wafer was attempted and it was verified that this measuring system could measure particle size with a sensitivity of about 24nm. And, the washing for the Si wafer by using a wet cleaning method was attempted to estimate the wet cleaning effect for nanoparticles on its surface. Consequently, it could be verified that the wet cleaning is an effectual method to remove standard nanoparticles of less than diameter of 30nm on Si wafer surface.