Abstract
Monocrystalline silicon is the most important material for semiconductor industry, and is also widely used as a component material of the semiconductor manufacturing equipment which needs the precision machining. However the high performance machining technology without micro cracks for brittle materials has not yet been established. Especially the high aspect ratio drilling less than 1 mm in diameter is very difficult. Therefore, the new drilling method of monocrystalline silicon was introduced in this paper. The experimental analysis made it clear that the mirror finished surface without micro cracks was obtained by using the monocrystalline diamond drill, while many micro cracks were generated in the case of sintered diamond drill. Furthermore, the removal rate and the tool life were enough for high performance drilling.
