Effect of Heating Substrates on Deposition Efficiency of Al₂O₃ Films Formed by Aerosol Deposition Method

Abstract

Aerosol Deposition Method(ADM)is a technique to form films by impacting solid particles on substrates.Dense ceramic films can be formed even at room temperature.Principal characteristics of ADM are particle diameter of starting powder,which is around several μm,and the process temperature. In this study,to improve the deposition efficiency of the ADM,the effect of heating Cu substrates on the deposition efficiency of Al₂O₃ films was investigated.The deposition efficiency increased about 2 times by heating the substrate at around 80℃.It was revealed that the films contained H as an impurity and the H content tended to decrease by heating substrate.The volume resistivity of the film also increased by heating the substrate.Considering that the quantity of H₂O detected on the starting powder was consistent with the H content in the films,it could be concluded that H₂O on the starting powder deteriorated the deposition efficiency and contaminated the films during the deposition.These results suggest that developing a process which can prevent H₂O from contaminating the films can improve the deposition efficiency of the ADM.