Abstract
An investigation of the adsorption of water vapour on copper, nickel and alumina ceramic surfaces has been carried out using a time lag method of molecular flow. It is estimated that the amounts adsorbed at 10-510-6Hg, 0°C125°C (0°C50°C for copper) are 28×10-7, 120×10-7and 390×10-7c.c. S.T.P/cm2 for copper, nickel and alumina ceramic surfaces respectively.These results are compared with the data on glass surfaces and are discussed.
The B.E.T. method for ethylene adsorption has also been studied.
