Abstract
Films of pure Ti and β-Ti alloy were deposited on Cu and W wires and on pencil lead by cylindrical magnetron sputtering with bias potential more negative than the target potential. Cross-sectional surfaces of films formed by fracturing were observed with SEM to study the effect of bias on film structures. For films of both Ti and β-Ti alloy on Cu wires prepared at high bias voltages, dimple patterns were always observed. It was concluded that bias potential was effective forming ductile films by this sputtering method and that dimple patterns in fracture implied that films were stable against fairly large plastic deformation. It was also shown that β-Ti alloy films were more ductile than pure Ti films.
