Preprints of the National Meeting of JWS
the national meeting 2004 autumn
Session ID : 210
Conference information

Host: japan welding soceity

Bonding of Cu-Si-Ti Filler Metals against Si3N4
*HIDEKI TAKASE, MASAAKI NAKA
Author information
Keywords: Brazing, Silicon Nitride, Wettability, Cu Alloy, Cu-Si-Ti
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (90K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2004 by Japan Welding Society
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top