Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 209
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Host: Japan Welding Society

Voidless bonding of copper using Cu/Sn multi-thin film
*Shinji Fukumoto, Takaaki Miyazaki, Takashi Fujimoto, Michiya Matsushima, Makoto Takahashi, Kozo Fujimoto
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Keywords: micro-joining, microstructure, diffusion, copper, void
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[in Japanese]
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© 2012 by Japan Welding Society
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