Preprints of the National Meeting of JWS
Session ID : 211
Conference information
Host: Japan Welding Society
Self-Formation Process for the Hybrid System of Sn-Bi Solder Particles and Silicone Polymer
Effect of the Distribution of Solder Particle Size on the Formation of Micro Bumps
Keywords:
solder bump,
self-formation,
micro joining,
metal wetting,
particle size distribution,
electronics packaging
Details
