Research Today
Pre-treatment with Stealth Type Laser Dicing for TEM Sample Preparation
2021 Volume 56 Issue 3 Pages 139-142
Details
2021 Volume 56 Issue 3 Pages 139-142
In the process of preparing TEM samples, many cutting/polishing operations are required as pretreatment. Here, we attempted to replace the typical pretreatment of cutting dices with a cutting wheel and polishing to a thickness of 100 μm with stealth dicing. This processing is particularly suitable for semiconductor wafers, and has many advantages such as time saving, high accuracy, automation, resource saving, dryness, and non-contact.
