On the Stress Measurement Method Using the Grain Growth Process of Electrodeposited Copper Foil : 3rd Report, Adaptation of Stress Measurement Method to Low Temperatures Using Grain Growth Rate

Abstract

The relation between the mean grain growth rate of grown grains in the electro-deposited copper foil by cyclic stress and the testing temperature was examined. The accuracy of the stress measurement method using mean grain growth rate and the propriety of the adaptation of its method to low temperatures were investigated. The grain growth process by cyclic stress is heat activated and the mean grain growth rate is expressed by an Ahrenius-type equation. The method proposed here is applicable to low temperature ranges where the conventional electroplating method cannot be applied.