An Analysis of Thermal Stresses or Strains in the Electronic Circuit Board Models

Abstract

In this study, experimental and numerical analyses for thermal stresses or strains of electronic circuit board models are performed. The circuit board models are constructed of two layers of copper and phenol resin with a width of 30mm, length of 80mm and thickness of 2mm. The shape is similar to that of some of the integrated circuits for practical use. The thermal stresses and strains of the models are analyzed by means of the finite-element method proposed in the previous paper. These numerical results are compared with the values obtained by the experiments. Furthermore, the influence of the circuit shapes for the thermal stresses distributions is discussed.