Simulation of the Viscoplastic Deformation of Copper at High Temperature Using the Unified Constitutive Model

Abstract

In this paper, to verify the applicability of the viscoplastic constitutive model, which was previously proposed by the authors, to the viscoplastic deformation at the high temperatures, a series of tests such as cyclic tension-compression loading with the constant strain amplitude under the constant strain rate and creep tests are carried out at the high temperatures by using oxygen-free copper (OFC). A cyclic tension-compression tests under variations of temperature is also conducted. The experimental results show that the temperature history does not affect stress-strain relations under cyclic tension-compression loading regardless of variations of temperature. Using the material constants determined by the cyclic tension-compression test at isothermal condition, creep and cyclic deformations under variations of temperature can be well simulated by the viscoplastic model.