2003 Volume 69 Issue 677 Pages 203-209
In order to investigate the mesoscopic stress field in polycrystal on the basis of the stress concentration due to the deformation constraint by the neighboring crystal, the crystallographic orientation and the 3-dimensional shape of each grain in a copper polycrystal specimen are specified by the repetition of processes: polish and observation with an orientation imaging microscope (OIM). Then, a finite element analysis for the polycrystal shows that the stress is concentrated on the region near the grain boundary. Especially the large stress concentration emerges near the twin boundary and the junction between grain boundaries. The high shear stress area, which is resolved to the crystallographic slip systems, corresponds to the location and crystallographic plane where the persistent slip bands are observed in a high cyclic fatigue test of the specimen.
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
Transactions of the Japan Society of Mechanical Engineers Series C
Transactions of the Japan Society of Mechanical Engineers Series B
