Small Cooling Fin Performances for LSI Packages

Abstract

An experimental study was performed to evaluate the cooling performance of small fins on natural air convection and on forced air convection, in order to design an effective cooling device for the recent compact LSI packages. The effect of supplied heat power, supplied wind velocity, fin pitch and fin height on the increase of fin temperature was examined. From these results, non dimensional expressions to evaluate the cooling performances of small fins were derived.